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Power chips are connected to exterior circuits through product packaging, and their performance relies on the assistance of the packaging. In high-power situations, power chips are usually packaged as power modules. Chip interconnection refers to the electric connection on the top surface of the chip, which is generally light weight aluminum bonding cord in traditional components. ^
Typical power module package cross-section

At present, commercial silicon carbide power modules still primarily use the product packaging modern technology of this wire-bonded standard silicon IGBT module. They face troubles such as big high-frequency parasitic parameters, insufficient warmth dissipation capability, low-temperature resistance, and not enough insulation strength, which restrict using silicon carbide semiconductors. The display of outstanding efficiency. In order to resolve these issues and fully make use of the huge possible benefits of silicon carbide chips, several new packaging technologies and services for silicon carbide power modules have arised in recent years.

Silicon carbide power component bonding approach

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have developed from gold cable bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold cords to copper wires, and the driving force is price reduction; high-power tools have created from aluminum wires (strips) to Cu Clips, and the driving force is to improve item efficiency. The greater the power, the higher the demands.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared to traditional bonding packaging approaches, Cu Clip modern technology has the complying with advantages:

1. The connection in between the chip and the pins is made of copper sheets, which, to a specific extent, changes the standard wire bonding method between the chip and the pins. For that reason, a distinct bundle resistance worth, higher present flow, and much better thermal conductivity can be obtained.

2. The lead pin welding area does not require to be silver-plated, which can fully save the expense of silver plating and poor silver plating.

3. The product look is totally consistent with typical products and is mostly made use of in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power products, and various other areas.

Cu Clip has 2 bonding methods.

All copper sheet bonding technique

Both eviction pad and the Resource pad are clip-based. This bonding technique is more pricey and complex, however it can accomplish much better Rdson and much better thermal results.

( copper strip)

Copper sheet plus cord bonding technique

The source pad utilizes a Clip technique, and the Gate utilizes a Cable approach. This bonding approach is a little less expensive than the all-copper bonding technique, conserving wafer location (suitable to extremely little gate locations). The procedure is easier than the all-copper bonding approach and can get better Rdson and much better thermal impact.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper scrap price per kg, please feel free to contact us and send an inquiry.

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